GlobalFoundries VP details FDX Fusion technology, sporting 7nm-class performance without the need for EUV tools — company targets 2030 for high-volume manufacturing, with planar tr — News for Startups

GlobalFoundries VP details FDX Fusion technology, sporting 7nm-class performance without the need for EUV tools — company targets 2030 for high-volume manufacturing, with planar tr

Eight years after GlobalFoundries abandoned the development of its 7nm FinFET technology, the company is preparing to return to 7nm-class performance, this time by going via a different route. Its FDX Fusion process, built on FD-SOI (fully depleted silicon-on-insulator) technology, promises 7nm-class performance using advanced planar transistors, with no EUV lithography necessary.

Tom's Hardware · 2026-11-06T14:00:00.000Z